
Electroless Nickel (EN)
Brightness
This is an electroless Ni-P plating solution that has the same level of brightness as cadmium additives without using any cadmium compounds, brightness additives, lead compounds, or bath stabilizers.
Hardness
This is a low phosphorus type of electroless Ni-P solution that provides high hardness in the precipitated condition and suits materials that cannot be heat treated.
Cracking
Thia is an electroless Ni-P plating solution that suppresses cracking during bending after plating and is resistant to cracking.
Thickness
Thia is an electroless Ni-P plating solution is suitable for coating with a thickness of 50 µm or more.
Black Nickel
This is an electroless Ni-P plating solution that has a darker tinge than conventional ones due to its finely uneven coating surface.
Environmentally friendly Nickel
This is an electroless Ni-P plating solution that does not use harmful substances such as lead, mercury, or cadmium and does not use any heavy metals other than Nickel.
Corrosion resistance
This is an electroless Ni-P plating solution that uses special stabilizer features excellent coverage, corrosion resistance, nitric acid resistance, and low internal stress. It is resistant to rust even though it is thin.
Wear resistance
This is an electroless Ni-P plating solution that has excellent wear resistance under high load conditions by containing cobalt and changing the blending properties of Ni crystals compared to conventional baths.
Sliding
Electroless Ni-P plating solution containing PTFE (polytetrafluoroethylene) fine particles. PTFE has a low coefficient of friction and is self-lubricating, so it can provide excellent sliding properties and is waterproof.
Electroless Nickel / Immersion Gold (ENIG)
ENIG is the industry standard for uniform mid-phos EN deposits with a topcoat of immersion gold. A unique, reduction-assisted immersion gold process deposits higher thicknesses “4 to 8 µin gold” in a single step, with no corrosive replacement reaction.

Deposits have a tighter grain and are more uniform than conventional immersion gold. It also has low contact resistance. ENIG creates a highly solderable surface that won’t discolor or tarnish and provides exceptional electrical continuity. The nickel component forms a barrier against copper diffusion and guards against contamination of the solder during soldering and re-work. ENIG also contributes EMI shielding. This final finish process is highly resistant to corrosion and suits contacting surface.

Pattern ability (L/S = 30/20 μm)
ENIG process never waste time and resources with “dummy plating”.
They are also efficient in:
A low-concentration, room temperature, chloride-free catalyst.
A bath-that runs at least 10 F below the competition.
Compatibility with the newest solder mask technology.
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